Manufacturing method for semiconductor apparatus and semiconductor apparatus
AssigneeCanon Kabushiki Kaisha
InventorsTatsuya Saito, Takayuki Sumida
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Abstract
A manufacturing method for a semiconductor apparatus sequentially includes bonding a first chip and a second chip together using an adhesive. The first chip includes a first electrode and has a protrusion, and the second chip has a recess. In the bonding, the first chip and the second chip are bonded together in such a manner that the protrusion is positioned into the recess. Further, the method includes forming a through hole in the second chip to expose the first electrode, the first surface being opposite to a second surface having the recess, and forming the second electrode which is electrically connected to the first electrode, in the through hole.
Claims11
A semiconductor apparatus comprising:
- a first chip including a first electrode and having a recess, the recess having a portion overlapping the first electrode in a plan view;
- a second chip including a silicon substrate and having a protrusion, the protrusion being positioned into the portion of the recess overlapping the first electrode in the plan view;
- a through hole formed in a region overlapping the first electrode in the plan view and extending through the silicon substrate;
- and
- a second electrode formed in the through hole and electrically connected to the first electrode,
- wherein the protrusion includes at least a silicon and the through hole is provided inside the protrusion.
Dependencies are inferred from the claim text.