Mounting apparatus

A mounting apparatus for mounting a semiconductor chip on a mounting body, the mounting apparatus comprising:

• a stage on which the mounting body is placed and supported by a base;
• a mounting head which is provided to be movable up and down above the stage and presses the semiconductor chip against the mounting body;
• a film disposition mechanism which interposes a belt cover film between the mounting head and the stage;
• and
• a control part, wherein the mounting head is electrically coupled to the control part and the stage,
• wherein the film disposition mechanism includes
• a film feeding part which comprises a feeding reel around which the cover film has been wound, wherein the film feeding part is installed to be fixed to the base,
• a film recovery part which comprises a recovery reel winding up the fed cover film, wherein the film recovery part is installed to be fixed to the base, and
• a relay shaft which is provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film, the relay shaft extending in a direction in which an axial direction of the relay shaft is inclined with respect to a moving direction immediately before bending of the cover film,
• wherein the stage directly coupled to top of the base and spaced apart from the feeding reel, the recovery reel and relay shaft.