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US 11,769,748 B2Granted
Semiconductor device having a metal clip with a solder volume balancing reservoir
AssigneeInfineon Technologies AG
InventorsThomas Stoek, Michael Stadler, Mohd Hasrul Zulkifli
Life of this patent
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Abstract
A semiconductor device includes a semiconductor die attached to a substrate and a metal clip attached to a side of the semiconductor die facing away from the substrate by a soldered joint. The metal clip has a plurality of slots dimensioned so as to take up at least 10% of a solder paste that reflowed to form the soldered joint. Corresponding methods of production are also described.
Claims20
A semiconductor device, comprising:
- a semiconductor die attached to a substrate;
- and
- a metal clip attached to a side of the semiconductor die facing away from the substrate by a soldered joint,
- wherein the metal clip has a plurality of slots dimensioned so as to take up at least 10% of a solder paste that reflowed to form the soldered joint.
1 more element
Dependencies are inferred from the claim text.