Chip structure, packaging structure and manufacturing method for chip structure

A manufacturing method for a chip structure, comprising steps of:

• providing at least one chip body such that the at least one chip body comprises at least one radio frequency front-end device;
• forming a redistribution layer on the at least one chip body;
• forming at least one pin on the redistribution layer such that each of the at least one pin is electrically connected to a corresponding radio frequency front-end device through a corresponding electrical connector extending through the redistribution layer, and each of the at least one radio frequency front-end device at least corresponds to one pin of the at least one pin, wherein an extending direction of the pin on a surface of the redistribution layer is consistent with an extending direction of the radio frequency front-end device corresponding to the pin on the surface of the redistribution layer;
• and a surface of the pin distal to the redistribution layer is a first plane,
• wherein the step of forming at least one pin on the redistribution layer such that each of the at least one pin is electrically connected to a corresponding radio frequency front-end device through a corresponding electrical connector extending through the redistribution layer comprises steps of:
• forming a via extending through the redistribution layer at a position where the redistribution layer covers the radio frequency front-end device;
• forming a first conductive connection layer of the electrical connector such that the first conductive connection layer covers a side wall and a bottom wall of the via and is electrically connected to the radio frequency front-end device;
• forming a second conductive connection layer of the electrical connector on the first conductive connection layer such that a recess is formed in the redistribution layer as a secondary via;
• coating photoresist on the second conductive connection layer, and performing an exposure process and a development process on the photoresist, to form a molding cavity of the pin and expose the secondary via;
• forming a conductive connection body of the electrical connector within the secondary via, and forming the pin within the molding cavity;
• and
• removing a portion of the first conductive connection layer and the second conductive connection layer which are not covered by the pin.