Chiplet first architecture for die tiling applications

An electronic package, comprising:

• a first mold layer having a first surface and a second surface opposite the first surface;
• a plurality of first dies embedded in the first mold layer;
• a second die embedded in a second mold layer, wherein the second die is positioned vertically over the plurality of first dies, wherein the first mold layer is not vertically between the second die and the plurality of first dies;
• a solder resist layer between the plurality of first dies and the second die;
• a first plurality of vias in the second mold layer, the first plurality of vias laterally spaced apart from a first side of the second die;
• and
• a second plurality of vias in the second mold layer, the second plurality of vias laterally spaced apart from a second side of the second die, the second side opposite the first side.

A method of fabricating an electronic package, comprising:

• placing a plurality of first dies on a carrier;
• disposing a first mold layer over the plurality of first dies, wherein contact pads of the first dies are exposed;
• attaching a second die to the plurality of first dies with first level interconnects (FLIs);
• disposing a second mold layer over the second die, wherein the second mold layer is not vertically between the second die and the plurality of first dies;
• forming a first plurality of vias in the second mold layer, the first plurality of vias laterally spaced apart from a first side of the second die, wherein the first plurality of vias extend along an entire vertical length of the second die;
• and
• forming a second plurality of vias in the second mold layer, the second plurality of vias laterally spaced apart from a second side of the second die, the second side opposite the first side, wherein the second plurality of vias extend along an entire vertical length of the second die.

An electronic system, comprising:

• a board;
• a multi-die package coupled to the board, wherein the multi-die package comprises:
• a first mold layer having a first surface and a second surface;
• a plurality of first dies, wherein the plurality of first dies are embedded in the first mold layer;
• and
• a second die coupled to the plurality of first dies, wherein active surfaces of the first dies face an active surface of the second die, wherein the second die is embedded in a second mold layer, wherein the second die is vertically over the active surface of the first dies, and wherein the second mold layer is not vertically between the second die and the plurality of first dies;
• a first plurality of vias in the second mold layer, the first plurality of vias laterally spaced apart from a first side of the second die, wherein the first plurality of vias extend along an entire vertical length of the second die;
• and
• a second plurality of vias in the second mold layer, the second plurality of vias laterally spaced apart from a second side of the second die, the second side opposite the first side, wherein the second plurality of vias extend along an entire vertical length of the second die.