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US 11,769,734 B2Granted
Microelectronic assemblies
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Johanna M. Swan
Life of this patent
Estimating the term…
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate including a dielectric material having a first surface and an opposing second surface, a first photodefinable material on at least a portion of the second surface, and a second photodefinable material on at least a portion of the first photodefinable material, wherein the second photodefinable material has a different material composition than the first photodefinable material.
Claims18
A method of manufacturing a package substrate, comprising:
- forming a layer of a first photodefinable material on a surface of a package substrate assembly, wherein the package substrate assembly includes conductive contacts at the surface;
- forming a layer of a second photodefinable material on the first photodefinable material, wherein the second photodefinable material has a different material composition from the first photodefinable material;
- and
- illuminating and developing the first photodefinable material and the second photodefinable material to create openings to expose the conductive contacts, wherein the illuminating and developing the first photodefinable material and the second photodefinable material includes:
- illuminating and developing the second photodefinable material;
- and
- after illuminating and developing the second photodefinable material, illuminating and developing the first photodefinable material.
4 more elements
A method of manufacturing a package substrate, comprising:
- forming a layer of a first photodefinable material on a surface of a package substrate assembly, wherein the package substrate assembly includes conductive contacts at the surface;
- forming a layer of a second photodefinable material on the first photodefinable material, wherein the second photodefinable material has a different material composition from the first photodefinable material;
- and
- illuminating and developing the first photodefinable material and the second photodefinable material to create openings to expose the conductive contacts, wherein the illuminating and developing the first photodefinable material and the second photodefinable material includes gray scale masking.
1 more element
A method of manufacturing a package substrate, comprising:
- forming a layer of a dielectric material on a surface of a package substrate assembly, wherein the package substrate assembly includes conductive contacts at the surface;
- forming a layer of a first photoresist on the dielectric material;
- forming a layer of a second photoresist on the first photoresist, wherein the second photoresist has a different material composition from the first photoresist;
- and
- illuminating and developing the first photoresist and the second photoresist to form a patterned photoresist;
- etching the dielectric material in accordance with a pattern of the patterned photoresist to create openings to expose the conductive contacts;
- and
- after etching the dielectric material, removing any residual first photoresist or second photoresist.
5 more elements
A method of manufacturing a package substrate, comprising:
- forming a layer of a dielectric material on a surface of a package substrate assembly, wherein the package substrate assembly includes conductive contacts at the surface;
- forming a layer of a first photoresist on the dielectric material;
- forming a layer of a second photoresist on the first photoresist, wherein the second photoresist has a different material composition from the first photoresist;
- and
- illuminating and developing the first photoresist and the second photoresist to form a patterned photoresist;
- and
- etching the dielectric material in accordance with a pattern of the patterned photoresist to create openings to expose the conductive contacts, wherein etching the dielectric material includes performing reactive ion etching.
4 more elements
A method of manufacturing a package substrate, comprising:
- forming a layer of a dielectric material on a surface of a package substrate assembly, wherein the package substrate assembly includes conductive contacts at the surface;
- forming a layer of a first photoresist on the dielectric material;
- forming a layer of a second photoresist on the first photoresist, wherein the second photoresist has a different material composition from the first photoresist;
- illuminating and developing the first photoresist and the second photoresist to form a patterned photoresist, wherein illuminating and developing the first photoresist and the second photoresist includes:
- illuminating and developing the second photoresist;
- and
- after illuminating and developing the second photoresist, illuminating and developing the first photoresist;
- and
- etching the dielectric material in accordance with a pattern of the patterned photoresist to create openings to expose the conductive contacts.
6 more elements
A method of manufacturing a package substrate, comprising:
- forming a layer of a dielectric material on a surface of a package substrate assembly, wherein the package substrate assembly includes conductive contacts at the surface;
- forming a layer of a first photoresist on the dielectric material;
- forming a layer of a second photoresist on the first photoresist, wherein the second photoresist has a different material composition from the first photoresist;
- illuminating and developing the first photoresist and the second photoresist to form a patterned photoresist, wherein illuminating and developing the first photoresist and the second photoresist includes gray scale masking. and
- etching the dielectric material in accordance with a pattern of the patterned photoresist to create openings to expose the conductive contacts.
2 more elements
Dependencies are inferred from the claim text.