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US 11,769,728 B2Granted
Backside power distribution network semiconductor package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSaehan Park, Hoonseok Seo, Jeonghyuk Yim, Ki-il Kim, Gil Hwan Son
Life of this patent
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Abstract
Provided is a semiconductor architecture including a carrier substrate, a landing pad included in the carrier substrate, a first semiconductor device provided on a first surface of the carrier substrate, the first semiconductor device including a first component provided on the landing pad, and a second semiconductor device provided on a second surface of the carrier substrate, a second component protruding from the second semiconductor device being provided on the landing pad.
Claims9
A semiconductor architecture comprising:
- a substrate;
- a landing pad included in the substrate;
- a first semiconductor device provided on a first surface of the substrate, the first semiconductor device comprising a first component provided on the landing pad;
- and
- a second semiconductor device provided on a second surface of the substrate, a second component protruding from the second semiconductor device being provided on the landing pad,
- wherein a width of a horizontal portion of a top surface of the landing pad contacting a bottom surface of the first component is greater than a width of the bottom surface the first component, and
- wherein a width of a horizontal portion of a bottom surface of the landing pad contacting a top surface of the second component is greater than a width of the top surface of the second component.
4 more elements
A semiconductor architecture comprising:
- a wafer;
- a landing pad provided in the wafer;
- a semiconductor device for signal routing provided on a first surface of the wafer, the semiconductor device comprising a BPR provided on the landing pad;
- and
- a power distribution network (PDN) semiconductor device provided on a second surface of the wafer, a TSV protruding from the PDN semiconductor device being provided on the landing pad,
- wherein a width of a horizontal portion of a top surface of the landing pad contacting a bottom surface of the BPR is greater than a width of the bottom surface the BPR, and
- wherein a width of a horizontal portion of a bottom surface of the landing pad contacting a top surface of the TSV is greater than a width of the top surface of the TSV.
4 more elements
Dependencies are inferred from the claim text.