Package having different metal densities in different regions and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sen-Bor Jan
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Abstract
A package has a first region and a second region surrounded by the first region. The package includes a first die, a second die, an encapsulant, and an inductor. The first die extends from the first region to the second region. The second die is bonded to the first die and is located within a span of the first die. The encapsulant is aside the second die. At least a portion of the encapsulant is located in the second region. The inductor is located in the second region. The inductor laterally has an offset from the second die. A metal density in the first region is greater than a metal density in the second region.
Claims20
A package having a first region and a second region surrounded by the first region, comprising:
- a first die, extending from the first region to the second region;
- a second die bonded to the first die, wherein the second die is located within a span of the first die;
- an encapsulant aside the second die, wherein at least a portion of the encapsulant is located in the second region;
- and
- an inductor located in the second region and laterally having an offset from the second die, wherein a metal density in the first region is greater than a metal density in the second region.
A package, comprising:
- a first die, comprising bonding pads and dummy bonding pads, wherein the dummy bonding pads are surrounded by the bonding pads, and a pattern density of the bonding pads is greater than a pattern density of the dummy bonding pads;
- a second die bonded to the first die to cover a first portion of the bonding pads;
- an encapsulant laterally encapsulating the second die, wherein the encapsulant is directly in contact with the dummy bonding pads and a second portion of the bonding pads;
- and
- an inductor over the dummy bonding pads.
A manufacturing method of a package, comprising:
- providing a wafer substrate having a first region and a second region surrounded by the first region, comprising:
- forming first bonding pads having a first pattern density in the first region;
- and
- forming dummy bonding pads having a second pattern density in the second region, wherein the first pattern density is greater than the second pattern density, and the first bonding pads and the dummy bonding pads are located at a same level height;
- placing a die on the first region of the wafer substrate, wherein the die comprises second bonding pads;
- bonding the second bonding pads of the die to a portion of the first bonding pads of the wafer substrate;
- laterally encapsulating the die by an encapsulant;
- and
- forming an inductor over the second region.
Dependencies are inferred from the claim text.