Method of forming a metal-insulator-metal (MIM) capacitor

A method of forming a capacitor, comprising:

• forming an interconnect layer including a lower interconnect element and a capacitor bottom plate;
• forming a passivation region over the interconnect element and the capacitor bottom plate;
• etching a top plate opening in the passivation region, thereby exposing a top surface of the capacitor bottom plate;
• etching a top plate opening in the passivation region over the capacitor bottom plate;
• forming a dielectric layer extending into the top plate opening and over the capacitor bottom plate;
• after forming the dielectric layer extending into the top plate opening, etching an interconnect via opening and a bottom plate contact opening in the passivation region;
• and
• depositing metal to concurrently form (a) an interconnect via in the interconnect via opening, (b) a capacitor top plate of in the top plate opening, and (c) a bottom plate contact in the bottom plate contact opening,
• wherein the interconnect via is conductively connected to the lower interconnect element, and the bottom plate contact is conductively connected to the capacitor bottom plate.

A method of forming a capacitor, comprising:

• forming a capacitor bottom plate in a lower metal layer;
• forming a passivation region over the capacitor bottom plate;
• forming a top plate opening in the passivation region, the top plate opening exposing a surface of the capacitor bottom plate;
• forming a bowl-shape dielectric layer structure in the top plate opening, the bowl-shape dielectric layer structure including at least one sidewall portion extending up from a bottom portion;
• after forming a bowl-shape dielectric layer structure in the top plate opening, forming a bottom plate contact opening in the passivation region;
• concurrently forming (a) a capacitor top plate in the top plate opening and (b) a bottom plate contact in the bottom plate contact opening;
• and
• concurrently forming a top plate connection element conductively connected to the capacitor top plate and a bottom plate connection element conductively connected to the bottom plate contact.