Electronic substrate with first and second wirings supplied with same potential
AssigneeAisin Corporation
InventorsTakanobu Naruse, Yasuhiro Sassa
Life of this patent
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AssigneeAisin Corporation
InventorsTakanobu Naruse, Yasuhiro Sassa
Estimating the term…
An electronic substrate connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface. The electronic substrate includes: a first wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate and is supplied with power supply from the main substrate via the back surface terminals; and a second wiring that electrically connects the front surface terminals and the back surface terminals in the electronic substrate, is supplied with power supply having the same potential as the first wiring from the main substrate via the back surface terminals, and is not electrically connected to the first wiring in the electronic substrate.
An electronic substrate that connects to a semiconductor component via a plurality of front surface terminals disposed in an array on a front surface and connects to a main substrate via a plurality of back surface terminals disposed in an array on a back surface, the electronic substrate comprising:
Dependencies are inferred from the claim text.