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US 11,769,715 B2Granted
Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsMasanari Seki, Daisuke Koike, Masahiko Hori
Life of this patent
Estimating the term…
Abstract
The semiconductor device of the present embodiment includes a lead frame having a projection portion, the projection portion having an upper face and a side face, a semiconductor chip provided above the projection portion, and a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in contact with the upper face and the side face, the bonding material bonding the lead frame and the semiconductor chip.
Claims20
A semiconductor device comprising:
- a lead frame having a projection portion and a first upper face provided around the projection portion, the projection portion having a second upper face and a plurality of side faces, and the first upper face being directly connected with each of the side faces;
- a semiconductor chip having a chip face, the semiconductor chip being provided above the projection portion, an area of the second upper face of the projection portion being smaller than an area of the chip face of the semiconductor chip;
- and
- a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in direct contact with the semiconductor chip, the second upper face of the projection portion and the side faces of the projection portion.
1 more element
A semiconductor device comprising:
- a lead frame having a projection portion and a first upper face provided around the projection portion, the projection portion having a second upper face and a plurality of side faces, and the first upper face being directly connected with each of the side faces, the second upper face comprising a first width in a first direction along the second upper face;
- a semiconductor chip having a chip face, the semiconductor chip being provided above the projection portion, the chip face comprising a second width in the first direction, the second width being longer than the first width;
- and
- a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in direct contact with the semiconductor chip, the second upper face of the projection portion and the side faces of the projection portion.
1 more element
Dependencies are inferred from the claim text.