Semiconductor device including a through silicon via structure and method of fabricating the same
AssigneeSK hynix Inc.
InventorsJung Yong Chae, Jin Hee Cho
Life of this patent
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Abstract
A semiconductor device may include a via hole, a first electrode, a second electrode and a first protecting insulation layer. The via hole may be formed to penetrate a substrate. The first electrode may include an electrode segment formed on a surface of the via hole. The second electrode may be formed on the first electrode along the surface of the via hole. The second electrode may include two ends that are positioned below a surface of the substrate. The first protecting insulation layer may be formed on the second electrode along the surface of the via hole. The first protecting insulation layer may include both ends that upwardly protrude from the both ends of the second electrode.
Claims19
A semiconductor device, comprising:
- a via hole formed to penetrate a substrate;
- a first electrode including an electrode segment formed on a surface of the via hole;
- a second electrode formed on the first electrode along the surface of the via hole, the second electrode including two ends that are positioned below a surface of the substrate, the second electrode being in contact with the first electrode;
- and
- a first protecting insulation layer formed on the second electrode along the surface of the via hole, the first protecting insulation layer including two ends that upwardly protrude from the two ends of the second electrode.
A semiconductor device, comprising:
- a stack structure including a lower structure includes a lower substrate, a lower insulating interlayer disposed on the lower substrate, and a lower circuit disposed in the lower insulating interlayer, the lower circuit including a lower via pad, and an upper structure including an upper substrate, an upper insulating interlayer disposed on the upper substrate, and an upper circuit disposed in the upper insulating interlayer;
- a via hole disposed to penetrate the stack structure to expose the lower via pad;
- a first electrode including an electrode segment formed on a surface of the via hole;
- a second electrode formed on the first electrode along the surface of the via hole, the second electrode including both ends positioned below a surface of the stack structure;
- and
- a first protecting insulation layer formed on the second electrode along the surface of the via hole, the first protecting insulation layer including both ends upwardly protruding from the both ends of the second electrode.
A semiconductor device, comprising:
- a substrate including a lower element and an upper element stacked on the lower element, the substrate including a via hole penetrating the substrate between the lower element and the upper element;
- a first electrode formed along an inner surface of the via hole and an upper surface of the substrate;
- a second electrode formed in the via hole, the second electrode being in contact with the first electrode disposed in the via hole;
- and
- a first protecting insulation layer formed on the second electrode,
- wherein the via hole includes a first height, the second electrode includes a second height lower than the first height, and the first protecting insulation layer includes a third height between the first height and the second height.
Dependencies are inferred from the claim text.