Heterogeneous integration module comprising thermal management apparatus

A system comprising:

• a heterogeneous integration module comprising:
• a wiring substrate;
• a stiffener configured to be mechanically attached to a package substrate
• a first component attached to the wiring substrate;
• a second component attached to the wiring substrate, the first component and the second component being communicatively coupled together through the wiring substrate;
• a first thermal interface material disposed on the first component;
• a second thermal interface material disposed on the second component;
• and
• a thermal management apparatus contacting the first thermal interface material and the second thermal interface material, the thermal management apparatus comprises:
• a monolithic main portion overlying the first component and the second component;
• a first separate island attached to the main portion, and contacting the second thermal interface material, the first separate island being spring-biased against the main portion, wherein the thermal management apparatus has a first thermal energy flow path from where the thermal management apparatus contacts the first thermal interface material and having a second thermal energy flow path from where the thermal management apparatus contacts the second thermal interface material, the first thermal energy flow path having a lower thermal resistivity than the second thermal energy flow path;
• and
• a flange portion extending perpendicularly from a support portion of the thermal management apparatus and away from the main portion, the flange portion coupled to the stiffener via a first fastener capturing a first spring and a second fastener capturing a second spring, wherein the stiffener is configured to apply a downward force between the first separate island and the second component.

A method for forming a heterogeneous integration module, the method comprising:

• assembling a first component and a second component on a wiring substrate;
• and
• securing a thermal management apparatus in thermal communication with the first component and the second component, the thermal management apparatus comprising:
• a monolithic main portion overlying the first component and the second component;
• a first separate island attached to the main portion, and contacting a first thermal interface material disposed on the second component, the first separate island being spring-biased against the main portion, the thermal management apparatus having a first thermal energy flow path for thermal energy generated by the first component and having a second thermal energy flow path for thermal energy generated by the second component, the first thermal energy flow path having a lower thermal resistivity than the second thermal energy flow path;
• and
• a flange portion extending perpendicularly from a support portion of the thermal management apparatus and away from the main portion, the flange portion coupled to a stiffener via a first fastener capturing a first spring and a second fastener capturing a second spring, wherein the stiffener is configured to be attached to a package substrate and apply a downward force between the first separate island and the second component.