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US 11,769,708 B2Granted
Packaging-level chip and chip module packaged with magnetic cover, and electronic product
AssigneeInnogrit Technologies Co., Ltd.
InventorsYanwen Bai, Shiann-Ming Liou
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a packaging-level chip and a chip module packaged with a magnetic cover, and an electronic product. The packaging-level chip packaged with a magnetic cover comprises a die, a packaging material, a substrate and a magnetic cover. The packaging material is packaged on the outside of the die which is arranged on the substrate, and the magnetic cover is packaged on the top of the packaging material and is magnetic.
Claims18
A packaging-level chip comprising:
- a die;
- a packaging material configured to be packaged on outside of the die;
- a substrate on which the die is arranged;
- and
- a magnetic cover including a block-shaped magnet, wherein the magnet is arranged inside the magnetic cover and the magnet is spaced apart from a surface of the magnetic cover, the magnetic cover is configured to be packaged on top of the packaging material, the magnetic cover is configured to suppress coupling between a magnetic field of the magnet and a magnetic field of another component of the packaging-level chip, and a magnetic force exerted by the magnetic cover is configured to guide a heat dissipation member to an attachment position with respect to the magnetic cover.
2 more elements
A chip module comprising:
- a packaging-level chip comprising:
- a die;
- a packaging material configured to be packaged on outside of the die;
- a substrate on which the die is arranged;
- and
- a magnetic cover including a block-shaped magnet, wherein the magnet is arranged inside the magnetic cover and the magnet is spaced apart from a surface of the magnetic cover, the magnetic cover is configured to be packaged on top of the packaging material and the magnetic cover is configured to suppress coupling between a magnetic field of the magnet and a magnetic field of another component of the packaging-level chip;
- a printed circuit board on which the packaging-level chip is arranged;
- and
- a heat dissipation member which is magnetically attracted to the magnetic cover, wherein a magnetic force exerted by the packaging-level chip is configured to guide the heat dissipation member to an attachment position with respect to the magnetic cover.
6 more elements
An electronic product, comprising:
- a chip module, the chip module comprising:
- a packaging-level chip comprising
- a die,
- a packaging material configured to be packaged on outside of the die;
- a substrate on which the die is arranged, and
- a magnetic cover including a block-shaped magnet, wherein the magnet is arranged inside the magnetic cover and the magnet is spaced apart from a surface of the magnetic cover, the magnetic cover is configured to be packaged on top of the packaging material and the magnetic cover is configured to suppress coupling between a magnetic field of the magnet and a magnetic field of another component of the packaging-level chip;
- a printed circuit board on which the packaging-level chip is arranged;
- and
- a heat dissipation member which is magnetically attracted to the magnetic cover, wherein a magnetic force exerted by the packaging-level chip is configured to guide the heat dissipation member to an attachment position with respect to the magnetic cover.
6 more elements
Dependencies are inferred from the claim text.