Chip component and method of manufacturing the same

A method of manufacturing a chip component, comprising:

• in a chip forming region of a base substrate having a first surface in which the chip forming region is set and a second surface on an opposite side from the first surface, forming a terminal electrode on the first surface;
• forming, in the first surface of the base substrate, a recessed portion bulging outward beyond a border demarcating the chip forming region by selectively etching the base substrate from the first surface along the border;
• forming a groove integrated with the recessed portion by digging down a bottom portion of the recessed portion with a width smaller than the recessed portion in a thickness direction of the base substrate;
• forming a base resin layer that fills the groove and the recessed portion and covers the chip forming region;
• removing an unnecessary part of the base resin layer, the unnecessary part covering the chip forming region, such that a part embedded in the groove and the recessed portion remains;
• grinding the second surface of the base substrate until the base resin layer is exposed;
• and
• cutting out the chip component from the base substrate by cutting the base resin layer such that a part of the base resin layer, the part covering an inner surface of the groove, remains, wherein the chip component comprises:
• a substrate having
• a first surface,
• a second surface on an opposite side from the first surface of the substrate, and
• a third surface that connects the first surface of the substrate to the second surface of the substrate;
• an external surface resin that covers at least the third surface of the substrate, wherein
• the external surface resin includes an end portion on a first surface side of the substrate, and
• the end portion of the external surface resin has an inclined surface inclined with respect to the first surface of the substrate;
• the terminal electrode disposed in the first surface of the substrate and exposed from the external surface resin;
• and
• the recessed portion formed in an end portion of the third surface of the substrate, wherein
• the end portion of the third surface is on the first surface side,
• the external surface resin is embedded in the recessed portion, and
• the recessed portion has an annular shape enclosing the first surface of the substrate as viewed in plan.