Amplifier module

An amplifier module comprising:

• a multilayer board;
• an integrated circuit device mounted in or on the multilayer board, the integrated circuit device including an amplifier circuit;
• and
• a common bump, an input bump, and an output bump that connect the multilayer board and the integrated circuit device, wherein
• the integrated circuit device includes an input terminal on a device side to which a radio frequency signal is input, an output terminal on the device side from which a radio frequency signal is output, and a common terminal on the device side to which a ground potential is given,
• the multilayer board includes
• a common terminal, an input terminal, and an output terminal on a board side provided on a mounting surface on which the integrated circuit device is mounted, the common terminal, the input terminal, and the output terminal on the board side being arranged at locations that at least partially overlap the common terminal, the input terminal, and the output terminal on the device side in plan view, respectively,
• a lower surface common terminal provided on a lower surface opposite to the mounting surface, the lower surface common terminal being arranged at a location that at least partially overlaps the common terminal on the board side in the plan view,
• a first common via conductor arranged at a location that at least partially overlaps the common terminal on the board side in the plan view, the first common via conductor being directly connected to the common terminal on the board side,
• a second common via conductor arranged at a location that at least partially overlaps the first common via conductor in the plan view, the second common via conductor being arranged at a location deeper than the first common via conductor when viewed from the mounting surface, the second common via conductor being electrically connected to the first common via conductor,
• a third common via conductor arranged at a location that overlaps the first common via conductor in the plan view, the third common via conductor being directly connected to the lower surface common terminal, the third common via conductor being electrically connected to the second common via conductor, and
• a first input via conductor directly connected to the input terminal on the board side,
• the common bump connects the common terminal on the device side and the common terminal on the board side,
• the input bump connects the input terminal on the device side and the input terminal on the board side,
• the output bump connects the output terminal on the device side and the output terminal on the board side,
• an area of the first common via conductor in the plan view is larger than any one of areas of the second common via conductor, the third common via conductor, and the first input via conductor in the plan view, and
• an area of the common bump in the plan view is larger than an area of the input bump in the plan view.