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US 11,769,701 B2Granted
Protector cap for package with thermal interface material
AssigneeInfineon Technologies Austria AG
InventorsChristian Kasztelan, Nee Wan Khoo
Life of this patent
Estimating the term…
Abstract
A package includes an electrically conductive carrier, an electronic component on the carrier, an encapsulant encapsulating part of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of the interface structure. Corresponding methods of manufacturing and operating the package are also described.
Claims9
A package, comprising:
- an electrically conductive carrier;
- an electronic component on the carrier;
- an encapsulant encapsulating part of the carrier and the electronic component;
- an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier;
- and
- a protection cap covering at least part of an exposed surface of the interface structure,
- wherein the protection cap is configured for being reversibly attachable to and detachable from a package body formed by the carrier, the electronic component, the encapsulant and the interface structure.
4 more elements
A package, comprising:
- an electrically conductive carrier;
- an electronic component on the carrier;
- an encapsulant encapsulating part of the carrier and the electronic component;
- an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier;
- and
- a protection cap covering at least part of an exposed surface of the interface structure,
- wherein the protection cap comprises a plastic material.
4 more elements
A package, comprising:
- an electrically conductive carrier;
- an electronic component on the carrier;
- an encapsulant encapsulating part of the carrier and the electronic component;
- an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier;
- and
- a protection cap covering at least part of an exposed surface of the interface structure,
- wherein the protection cap comprises in an interior of the protection cap a guide structure for guiding the encapsulant within the protection cap.
4 more elements
A package, comprising:
- an electrically conductive carrier;
- an electronic component on the carrier;
- an encapsulant encapsulating part of the carrier and the electronic component;
- an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier;
- a protection cap covering at least part of an exposed surface of the interface structure;
- and
- a clip configured for connecting the package to a heat dissipation body.
4 more elements
A package, comprising:
- an electrically conductive carrier;
- an electronic component on the carrier;
- an encapsulant encapsulating part of the carrier and the electronic component;
- and
- an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, a protection cap covering at least part of an exposed surface of the interface structure,
- wherein a gap between an exterior surface of the interface structure and an inner surface of the protection cap is in a range between 50 μm and 1 mm.
3 more elements
A package, comprising:
- an electrically conductive carrier;
- an electronic component on the carrier;
- an encapsulant encapsulating part of the carrier and the electronic component;
- and
- an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of an exposed surface of the interface structure,
- wherein the carrier, the electronic component, the encapsulant and the interface structure form a package body, and wherein a through hole that extends axially through the protection cap serves as an accommodation volume for at least part of the package body.
3 more elements
Dependencies are inferred from the claim text.