Semiconductor substrate, semiconductor package including semiconductor substrate, and test method of semiconductor substrate

A semiconductor package comprising:

• a semiconductor substrate including an upper surface and a lower surface;
• a bump pad unit including a main bump pad disposed on the upper surface, and a plurality of side bump pads disposed on the upper surface to be spaced apart from the main bump pad;
• a bonding pad disposed on the upper surface;
• bumps comprising a first bump bonded to the bump pad unit and a second bump bonded to the bonding pad;
• test pads disposed on the upper surface or the lower surface;
• and
• traces provided in the semiconductor substrate to connect the main bump pad and the plurality of side bump pads to the test pads in a one-to-one manner,
• wherein the test pads are electrically connected to the main bump pad and the plurality of side bump pads, respectively, such that whether the main bump pad and the plurality of side bump pads are electrically connected is detected by a test signal input from outside of the semiconductor substrate,
• wherein energization states between the main bump pad and the plurality of side bump pads are detected to determine a bonding state between the bump pad unit and the first bump.