Semiconductor manufacturing apparatus and semiconductor manufacturing method

A semiconductor manufacturing apparatus comprising:

• a sound sensor configured to measure a first polishing sound of a film formed on a wafer;
• a controller configured to:
• generate a first regression model for obtaining a first sound pressure prediction value of the first polishing sound;
• perform a first calculation of the first sound pressure prediction value by using the first regression model;
• perform a second calculation of a first residual difference, the first residual difference being a difference between a first sound pressure actual measurement value of the first polishing sound and the first sound pressure prediction value;
• and
• determine a polishing end point of the film using the first residual difference;
• wherein the controller is configured to generate the first regression model using the first polishing sound measured between a second time earlier than a predetermined time zone, the predetermined time zone including a first time corresponding to the polishing end point of the film, and a third time earlier than the second time,
• wherein the processor is configured to generate the first regression model using the first polishing sound measured between a fourth time, the fourth time between the second time and the third time, and the third time, and wherein (fourth time−third time)/ (second time−third time)≤0.5.