Manufacturing method of semiconductor package

A manufacturing method of a semiconductor package, comprising:

• providing a plurality of semiconductor components, wherein each of the semiconductor components has at least one conductive bump;
• providing a substrate having a plurality of conductive pads, wherein the substrate is divided into a first region and a second region, and the conductive pads are located in the first region and the second region;
• providing a transfer device;
• transferring the semiconductor components onto the substrate by the transfer device, wherein the semiconductor components are disposed in the first region and the second region;
• providing a heating device;
• heating or pressurizing at least two of the semiconductor components in the first region or the second region by the heating device;
• and
• removing the heating device,
• wherein, in the step of transferring the semiconductor components onto the substrate, the at least one conductive bump of each of the semiconductor components is docked to corresponding ones of the conductive pads,
• wherein the heating device has a plurality of grooves, and the semiconductor components are correspondingly accommodated in the grooves when the heating device is in contact with the semiconductor components to perform the step of heating or pressurizing,
• wherein in the step of heating, the grooves perform heating on side walls of the semiconductor components accommodated in the grooves.

A manufacturing method of a semiconductor package, comprising:

• providing a plurality of semiconductor components, wherein each of the semiconductor components has at least one conductive bump;
• providing a substrate having a plurality of conductive pads;
• providing a transfer device;
• transferring the semiconductor components onto the substrate by the transfer device;
• providing a heating device;
• and
• heating or pressurizing at least two of the semiconductor components by the heating device,
• wherein, in the step of transferring the semiconductor components onto the substrate, the at least one conductive bump of each of the semiconductor components is docked to corresponding ones of the conductive pads,
• wherein the heating device has a plurality of grooves, and the semiconductor components are correspondingly accommodated in the grooves when the heating device is in contact with the semiconductor components to perform the step of heating or pressurizing,
• wherein in the step of heating, the grooves perform heating on side walls of the semiconductor components accommodated in the grooves.