US 11,769,684 B2 · Wafer heater with backside and integrated bevel purge

Abstract

Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

Claims18

Dependent claims

A substrate support comprising:

a plurality of bonded plates forming a single component support body having an outer peripheral edge, a top surface and a bottom surface defining a body thickness;
a pocket formed in the top surface of the support body, the pocket having a bottom surface, a depth and an outer peripheral edge;
and
a purge ring spaced a distance from the outer peripheral edge, the purge ring comprising at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

1 more element

A method of manufacturing a substrate support, the method comprising:

forming a top plate having a top surface and a bottom surface, a purge ring formed in the top surface with a plurality of openings extending through the top plate to the bottom surface;
forming a bottom plate having a top surface and a bottom surface, the bottom plate having a channel formed in the top surface spaced a distance from an outer peripheral edge of the bottom plate to align with the plurality of openings extending through the top plate to the purge ring;
and
bonding the top surface of the bottom plate to the bottom surface of the top plate to form a single component support body, wherein forming the top plate comprises bonding a first top plate to a second top plate to form a single component, the first top plate having the purge ring extending through the first top plate and a second top plate having a plurality of openings extending through the second top plate, the plurality of openings aligned with the purge ring in the first top plate, the first top plate and second top plate.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

18/080,421Filed 13 Dec 2022 · continuation

Priority

12 Oct 2019

Published

US 2023/0113057 A113 Apr 2023

Granted

26 Sep 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H10P 72/722
Using electrostatic chucks: details of electrostatic chucks
C23C 16/45521
Inert gas curtains: the gas, other than thermal contact gas, being introduced the rear of the substrate to flow around its periphery
C23C 16/4585
The substrate being supported substantially horizontally: devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
C23C 16/4586
The substrate being supported substantially horizontally: elements in the interior of the support, e.g. electrodes, heating or cooling devices

Family

Application62/914,474Us provisional application · filed 12 Oct 2019

Application17/066,974Parent of this continuation · filed 9 Oct 2020

US 2023/0113057 A1Pre-grant publication · published 13 Apr 2023

US 2021/0111059 A1Published application

US 11,769,684 B2This patent

From the US filing history. Foreign family members aren’t listed.

Wafer heater with backside and integrated bevel purge

Life of this patent

Wafer heater with backside and integrated bevel purge

Life of this patent

Abstract

Claims18