Semiconductor wafer processing system
AssigneeGlobalFoundries U.S. Inc.
InventorsWieland Pethe, Dirk Noack
Life of this patent
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Abstract
The embodiments herein relate to methods for processing a wafer through a semiconductor wafer processing system and an apparatus. According to an aspect of the present disclosure, a system for processing a semiconductor wafer is provided. The system includes a heating system, a pressure control system, and a gas flow system. The heating system is configured for heating a chuck. The pressure control system is configured for setting an internal chamber pressure. The gas flow system is configured for inflowing a gas in the process chamber to increase the internal chamber pressure to at least a base pressure. The heating system heats the chuck after the internal chamber pressure reaches the base pressure set by the pressure control system.
Claims18
A system for processing a semiconductor wafer, the system comprising:
- a heating system for heating a chuck;
- a pressure control system for setting an internal chamber pressure of a process chamber to a pressure level higher than an ambient pressure;
- and
- a gas flow system for inflowing a gas in the process chamber to increase the internal chamber pressure, wherein the heating system heats the chuck after the internal chamber pressure reaches at least a base pressure set by the pressure control system.
A method for processing a semiconductor wafer, the method comprising:
- providing a process chamber having a chuck therein;
- setting an internal chamber pressure to at least a base pressure higher than an ambient pressure;
- and
- heating the chuck after the process chamber reaches the base pressure.
A semiconductor processing tool, the tool comprising:
- a process chamber for a high-pressure wafer processing operation, wherein an internal chamber pressure can be set to at least a base pressure higher than an ambient pressure;
- and
- a chuck in the process chamber, the chuck having grooves in the chuck surface that terminate in the chuck, wherein when a wafer is placed on the chuck, air pockets are formed in the grooves having an air pressure lower than the base pressure.
Dependencies are inferred from the claim text.