Substrate processing method and substrate processing apparatus

A substrate processing method, comprising:

• discharging a processing liquid to a front surface of a substrate having a pattern while rotating of the substrate at a first rotation speed for a first period of time to form a liquid film of the processing liquid on the front surface of a substrate;
• terminating the discharging of the processing liquid and gradually increasing rotation speed of the substrate from the first rotation speed toward a second rotation speed that is greater than the first rotation speed;
• rotating the substrate at the second rotation speed for a second period of time, the second rotation speed and the second period of time being selected to spin off excess processing liquid from the front surface of the substrate;
• gradually reducing rotation speed of the substrate from the second rotation speed toward a third rotation speed, the third rotation speed being lower than the first rotation speed and the second rotation speed;
• rotating the substrate at the third rotation speed for a third period of time, the third speed and the third period of time being selected to allow the processing liquid of the liquid film to fill the pattern on the front surface of the substrate and to level the processing liquid;
• gradually increasing speed of rotation from the third rotation speed toward a fourth rotation speed that is higher than the third rotation speed while discharging inert gas toward the front surface of the substrate to solidify the liquid film on the front surface of the substrate;
• and
• removing solidified liquid from the liquid film from the front surface of the substrate by sublimating the solidified liquid.