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US 11,769,661 B2Granted
Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsHirofumi Takeguchi, Kazuyoshi Shinohara, Takahisa Otsuka, Suguen Lee
Life of this patent
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Abstract
A substrate processing method includes a first cleaning process and a second cleaning process. In the first cleaning process, a substrate is cleaned with a first cleaning solution. In the second cleaning process, the substrate is cleaned with a second cleaning solution having a lower cleanliness than the first cleaning solution after the first cleaning process.
Claims5
A substrate processing method, comprising:
- cleaning a first surface of a substrate with a first cleaning solution discharged from a first nozzle;
- cleaning the first surface with a second cleaning solution having a lower cleanliness than the first cleaning solution and discharged from the first nozzle after the cleaning of the substrate with the first cleaning solution;
- cleaning the first surface of the substrate with a third cleaning solution discharged from the first nozzle after the cleaning of the substrate with the second cleaning solution;
- and
- cleaning a second surface of the substrate with the second cleaning solution discharged from a second nozzle different from the first nozzle;
- wherein a total time period of the cleanings of the first surface with the first and third cleaning solutions is shorter than a time period of the cleaning of the first surface with the second cleaning solution,
- wherein the first and third cleaning solutions are unused cleaning solutions, and
- the second cleaning solution is a used cleaning solution recovered from the first cleaning solution.
5 more elements
Dependencies are inferred from the claim text.