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US 11,769,612 B2Granted
Chip resistor
AssigneeRohm Co., Ltd.
InventorKohsuke Moriya
Life of this patent
Estimating the term…
Abstract
A chip resistor includes a resistor body, a first upper surface electrode, a second upper surface electrode, and an upper surface protection film on an upper surface of a substrate. The upper surface protection film covers the entire surface of the resistor body and the entire surface of the first upper surface electrode and the second upper surface electrode. The upper surface protection film includes a peripheral portion that is entirely in contact with the upper surface of the substrate.
Claims19
A chip resistor, comprising:
- a substrate including an upper surface and a lower surface that face in opposite directions in a thickness-wise direction, a first side surface and a second side surface that face in opposite directions in a first direction, the first direction being orthogonal to the thickness-wise direction, and a first through hole and a second through hole that extend through the substrate between the upper surface and the lower surface;
- a resistor body disposed on the upper surface;
- an upper surface protection film covering the resistor body and including a peripheral end portion that is entirely in contact with the upper surface;
- a first upper surface electrode and a second upper surface electrode disposed on the upper surface, each of the first upper surface electrode and the second upper surface electrode including an inner end overlapping the resistor body;
- a first lower surface electrode and a second lower surface electrode disposed on the lower surface and separated from each other in the first direction;
- a first inner electrode disposed in the first through hole and connecting the resistor body and the first lower surface electrode;
- a second inner electrode disposed in the second through hole and connecting the resistor body and the second lower surface electrode;
- a first side surface protection film disposed on the first side surface;
- and
- a second side surface protection film disposed on the second side surface,
- wherein the first side surface protection film is electrically connected to the first lower surface electrode and is electrically disconnected from the first upper surface electrode, and
- wherein the second side surface protection film is electrically connected to the second lower surface electrode and is electrically disconnected from the second upper surface electrode.
9 more elements
Dependencies are inferred from the claim text.