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US 11,769,604 B1Granted
Residue free electrically conductive material
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorsBrad L Cumby, Christopher Tabor
Life of this patent
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Abstract
A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.
Claims10
A method for making deformable microcapsules containing a gallium liquid metal alloy core, the method comprising the steps of:
- providing a double-T-junction apparatus having a first T-junction and a second T-junction;
- flowing at a rate of about 0.1 mL/Hr a gallium liquid metal alloy emulsion to the first T-junction containing a first aqueous carrier fluid to form first droplets in the first aqueous carrier fluid at a rate of about 100 mL/Hr;
- flowing at a rate of about 0.1 mL/Hr the first droplets to the second T-junction containing an emulsion of a polymerizable material in a second carrier fluid flowing at a rate of about 100 mL/Hr to form second droplets containing the first droplets as a core and the polymerizable material as a shell;
- and
- polymerizing the polymerizable material to provide the deformable microcapsules containing the gallium liquid metal alloy core,
- wherein the shell of the deformable microcapsules has conductive properties.
3 more elements
Dependencies are inferred from the claim text.