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US 11,769,534 B2Granted
Flexible memory system with a controller and a stack of memory
AssigneeMicron Technology, Inc.
InventorsJoe M. Jeddeloh, Brent Keeth
Life of this patent
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Abstract
Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.
Claims19
A method, comprising:
- accessing multiple DRAM memory die stacked above a substrate,
- wherein each die includes multiple partitions which each operate independently from other partitions of the multiple partitions on the die, and
- wherein vertically interconnected partitions of two or more stacked memory die are interconnected to form respective memory assemblies;
- and
- through use of control logic supported by the substrate,
- exchanging first data with a memory assembly through first data interface contacts,
- exchanging second data with a second memory assembly through second data interface contacts, and
- providing command signals to both of the first and second memory assemblies through shared command interface contacts in communication with both the first and second memory assemblies.
5 more elements
A method, comprising:
- accessing multiple DRAM memory die through use of a controller,
- wherein the multiple DRAM memory die are stacked above the controller,
- wherein each DRAM memory die includes multiple partitions which operate independently as to data transfer from other partitions on the respective DRAM memory die,
- wherein multiple vertically interconnected partitions of two or more stacked memory die are interconnected to form multiple respective memory assemblies and wherein the multiple respective memory assemblies are interconnected with the controller, and
- wherein the controller includes multiple interface blocks;
- and
- wherein accessing multiple DRAM memory die through the use of the controller comprises:
- exchanging first data with a first memory assembly through a first group of data interface contacts, including respective contacts for data input/output signals and timing signals,
- exchanging second data with a second memory assembly through a second group of data interface contacts including respective contacts for data input/output and timing signals, and
- providing command signals to both of the first and second memory assemblies through a command interface block including a shared group of command interface contacts.
7 more elements
A method, comprising,
- accessing multiple stacked DRAM memory die through use of a controller,
- wherein each DRAM memory die includes multiple partitions which operate independently from other partitions as to data movement;
- wherein multiple vertically arranged partitions of the stack are interconnected to form multiple respective memory assemblies;
- wherein the controller and the multiple stacked memory die are supported by a substrate, wherein the controller is configured, to interface with a first memory assembly through first data interface contacts, to interface with a second memory assembly through second data interface contacts, and to interface with at least the first and second memory assemblies through a shared group of command interface contacts;
- and
- wherein the controller receives and processes memory access requests between a host and the multiple stacked DRAM die, to access the memory assembly to which an individual memory access request is directed.
3 more elements
Dependencies are inferred from the claim text.