Method and apparatus for measuring eccentricity of blind via hole formed in printed circuit board

An apparatus for measuring eccentricity of a blind via hole formed in a printed circuit board, which is an apparatus for measuring eccentricity of a blind via hole formed in a printed circuit board including an inner-layer board made of a flame retardant (FR) 4 material and an outer-layer board made of a Teflon material which are bonded by thermocompression bonding, the apparatus comprising:

• a microscope camera configured to acquire an image by photographing a marker which is formed on a surface of the outer-layer board and a blind via hole which is exposed upward through a marker hole formed in a center of the marker with a microscope camera;
• and
• computing equipment configured to receive the image from the microscope camera and measure eccentricity indicating a separation distance and a separation direction from central coordinates of the marker hole to central coordinates of the blind via hole using a distance between an end point of the marker hole and an end point of the blind via hole which are included in the image,
• wherein the computing equipment measures the eccentricity using a curvature of the blind via hole and a curvature of the marker hole which appear on the image when only a portion of an entire circular shape of the blind via hole is exposed upward by the marker.