Exposed pad integrated circuit package
AssigneeTexas Instruments Incorporated
InventorsReynaldo Corpuz Javier, Alok Kumar Lohia, Andy Quang Tran
Life of this patent
Estimating the term…
Abstract
An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.
Claims21
An integrated circuit (“IC”) assembly, comprising:
- an exposed pad IC package having:
- a thermal pad having a top surface and a bottom surface and having at least one peripheral surface portion extending transversely of and continuous with the bottom surface;
- and
- a layer of mold compound through which the bottom surface and the at least one peripheral surface portion are exposed, wherein:
- the at least one peripheral surface portion is flushed with a surface of the layer of mold compound;
- and
- the at least one peripheral surface portion corresponds to a surface of a flange that extends transversely of the top surface of the thermal pad.
An integrated circuit (“IC”) assembly, comprising:
- an exposed pad IC package including:
- a thermal pad having a top surface and a bottom surface and having at least one peripheral surface portion extending transversely of and continuous with the bottom surface;
- and
- a layer of mold compound through which the bottom surface and the at least one peripheral surface portion are exposed, wherein
- the at least one peripheral surface portion includes at least one of a front and a rear peripheral surface portion;
- and
- at least one of the front and rear peripheral surface portions of the thermal pad includes at least one flange extending transversely of the top and bottom surfaces of the thermal pad, the at least one flange having an exposed surface.
An integrated circuit (“IC”) assembly, comprising:
- an exposed pad IC package including:
- a thermal pad having a top surface and a bottom surface and having at least one peripheral surface portion extending transversely of and continuous with the bottom surface;
- a plurality of leads extending laterally outwardly of first and second lateral side edges of the thermal pad, wherein the plurality of leads comprise outer terminal end portions having generally flat bottom surfaces;
- a die attached to the top surface of the thermal pad, the die having electrical contact surfaces thereon electrically connected to the plurality of leads;
- and
- a layer of mold compound through which the bottom surface and the at least one peripheral surface portion are exposed.
Dependencies are inferred from the claim text.