Touch substrate and method of forming the same, and touch display device

A method of forming a touch substrate, comprising:

• forming a plurality of electrode connecting bridges on a base, wherein the plurality of electrode connecting bridges are arranged in an array form;
• forming a signal wiring layer at a side, away from the base, of the electrode connecting bridge, wherein the signal wiring layer comprises a plurality of first signal wires and a plurality of second signal wires;
• forming an insulating layer at a side, away from the base, of the signal wiring layer, wherein the insulating layer comprises first insulating patterns being in one-to-one correspondence with the electrode connecting bridges and a second insulating pattern completely covering the signal wiring layer;
• and
• forming a touch electrode layer at a side, away from the base, of the insulating layer, wherein the touch electrode layer comprises a plurality of first touch electrodes and a plurality of second touch electrodes, and the first touch electrodes and the second touch electrodes are arranged in a crossed manner;
• the first signal wires are electrically connected with the first touch electrodes in a one-to-one correspondence manner, and the second signal wires are electrically connected with the second touch electrodes in a one-to-one correspondence manner;
• an orthographic projection of the first touch electrode onto the base and an orthographic projection of the electrode connecting bridge onto the base have a first overlapping area, and the first insulating patterns cover the first overlapping areas in a one-to-one correspondence manner;
• each second touch electrode comprises a plurality of electrode patterns which are arranged at intervals, and adjacent electrode patterns in the plurality of electrode patterns are electrically connected through the electrode connecting bridge;
• and
• wherein the method further comprises:
• forming a plurality of binding pins, wherein a first part of binding pins in the plurality of binding pins are electrically connected with the first signal wires in a one-to-one correspondence manner, and a second part of binding pins in the binding pins are electrically connected with the second signal wires in a one-to-one correspondence manner;
• and the binding pin comprises a first binding pattern, a second binding pattern and a third binding pattern which are sequentially stacked along a direction away from the base;
• the forming the plurality of binding pins specifically comprises:
• simultaneously forming the first binding pattern and the electrode connecting bridges through one patterning process;
• simultaneously forming the second binding pattern and the signal wiring layer of an integrated structure through one patterning process;
• and
• simultaneously forming the third binding pattern and the touch electrode layer through one patterning process.