Backlight assembly, manufacturing method thereof, and display device

A backlight assembly, comprising:

• a substrate;
• an anode trace and a cathode trace of an LED on the substrate;
• a planarization layer on a layer where the anode trace and the cathode trace of the LED are located;
• and
• an anode connection pad and a cathode connection pad on the planarization layer,
• wherein the anode trace of the LED is coupled to the anode connection pad through a first via hole penetrating through the planarization layer, and the cathode trace of the LED is coupled to the cathode connection pad through a second via hole penetrating through the planarization layer,
• wherein an exhaust channel is further arranged on the planarization layer to release gas accumulated in the planarization layer;
• and
• the backlight assembly further comprises a passivation layer on a layer where the anode connection pad and the cathode connection pad are located, and a reflection layer on the passivation layer, and the backlight assembly further comprising an LED accommodating part penetrating through the passivation layer and the reflecting layer, and an opening penetrating through the reflecting layer, wherein the LED accommodating part exposes the anode connection pad and the cathode connection pad;
• and the opening penetrating through the reflection layer serves as the exhaust channel;
• or
• the backlight assembly further comprises a passivation layer on a layer where the anode connection pad and the cathode connection pad are located, and a reflection layer on the passivation layer;
• and the backlight assembly further comprising an LED accommodating part and an opening each of which penetrates through the passivation layer and the reflection layer, wherein the LED accommodating part exposes the anode connection pad and the cathode connection pad, and the opening penetrating through the passivation layer and the reflection layer serves as the exhaust channel.

A manufacturing method for a backlight assembly comprising:

• forming a pattern comprising an anode trace and a cathode trace of an LED on a substrate by a patterning process;
• forming a planarization layer on a layer where the anode trace and the cathode trace of the LED are located, and forming a first via hole and a second via hole in the planarization layer;
• forming a pattern comprising an anode connection pad and a cathode connection pad on the planarization layer by a patterning process, wherein the anode trace of the LED is coupled to the anode connection pad through the first via hole penetrating through the planarization layer, and the cathode trace of the LED is coupled to the cathode connection pad through the second via hole penetrating through the planarization layer;
• forming an exhaust channel on the planarization layer to discharge gas accumulated in the planarization layer;
• and
• wherein an auxiliary structure is further formed at the same time as the anode connection pad and the cathode connection pad are formed, the auxiliary structure comprising a first component and a second component sequentially arranged along a direction away from the substrate, wherein the second component of the auxiliary structure has a bottom surface proximal to the substrate, an orthographic projection of the bottom surface of the second component of the auxiliary structure on the substrate covers an orthographic projection of the first component of the auxiliary structure on the substrate;
• the method further comprises forming a passivation layer after forming the anode connection pad, the cathode connection pad, and the auxiliary structure, wherein an LED accommodating part is formed in the passivation layer, and the LED accommodating part exposes the anode connection pad and the cathode connection pad;
• and the passivation layer, the bottom surface of the second component of the auxiliary structure, and the first component of the auxiliary structure define the exhaust channel;
• or
• the manufacturing method, after forming the anode connection pad and cathode connection pad, further comprises:
• sequentially forming a passivation layer and a reflection layer;
• and forming a pattern comprising an LED accommodating part penetrating through the passivation layer and the reflection layer and an opening penetrating through the reflection layer by a one-step patterning process, wherein the LED accommodating part exposes the anode connection pad and the cathode connection pad, and the opening penetrating through the reflection layer serves as the exhaust channel;
• or
• sequentially forming a passivation layer and a reflection layer, and forming a pattern comprising an LED accommodating part and an opening each of which penetrates through the passivation layer and the reflection layer by a one-step patterning process, wherein the LED accommodating part exposes the anode connection pad and the cathode connection pad, and the opening penetrating through the passivation layer and the reflection layer serves as the exhaust channel.