Techniques for compact LIDAR system
AssigneeAeva, Inc.
InventorsZhizhong Tang, Pradeep Srinivasan, Bing Shen
Life of this patent
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Abstract
A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.
Claims21
A light detection and ranging (LIDAR) apparatus, comprising:
- a photonics chip mounted to a substrate, the photonics chip comprising one or more optical components and one or more electrical components;
- and
- one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.
A light detection and ranging (LIDAR) system, comprising:
- a photonics chip mounted to a substrate, the photonics chip comprising one or more optical components and one or more electrical components;
- and
- one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and one or more electrical components wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR system.
A method comprising:
- mounting an integrated circuit (IC) chip to a surface of a photonics chip, the photonics chip comprising one or more optical components and one or more electrical components;
- and
- mounting the photonics chip to a substrate, wherein the IC mounted to the surface of the photonics chip is electrically coupled to the substrate, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk between the IC chips and electronics of the substrate.
Dependencies are inferred from the claim text.