Current sensor integrated circuit with a dual gauge lead frame

A current sensor integrated circuit (IC) comprising:

• a unitary lead frame comprising a primary conductor and at least one secondary lead spaced from the primary conductor, wherein the primary conductor has a first thickness between an input portion and an output portion between which a current flows and wherein the at least one secondary lead has a second thickness less than the first thickness;
• a semiconductor die disposed adjacent to the primary conductor and comprising a magnetic field sensing circuit to sense a magnetic field associated with the current and to generate a secondary signal indicative of the current for coupling to the least one secondary lead;
• an insulation structure disposed between the primary conductor and the semiconductor die;
• and
• a mold material configured to enclose the semiconductor die, the insulation structure, and a portion of the lead frame to form a package, wherein the primary conductor has a first surface proximate to the semiconductor die and a second surface exposed outside of the package, wherein the mold material encloses a first portion of the at least one secondary lead, wherein a second portion of the at least one secondary lead is exposed at an intermediate height of an outside edge of the package and has the second thickness.