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US 11,768,229 B2Granted
Packaged current sensor integrated circuit
AssigneeAllegro MicroSystems, LLC
InventorsBradley Boden, Rishikesh Nikam, Robert A. Briano
Life of this patent
Estimating the term…
Abstract
A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.
Claims19
A packaged current sensor integrated circuit comprising:
- a primary conductor having an input lead and an output lead, a first die attach portion, a second die attach portion and a current conductor portion between the first and second die attach portions, wherein the primary conductor is configured to carry a current from the input lead through the first die attach portion, the current conductor portion, the second die attach portion, to the output lead, wherein at least one of the first and second die attach portions has a die attach portion edge adjacent to the respective one of the input or output lead;
- a mechanical locking feature spaced from the die attach portion edge and the current conductor portion;
- at least one secondary lead;
- a semiconductor die supported by the first and second die attach portions;
- at least one magnetic field sensing element supported by the semiconductor die;
- wherein the at least one magnetic field sensing element is positioned adjacent to the current conductor portion;
- and
- a package body enclosing the semiconductor die and at least a portion of the primary conductor, wherein the input lead and the output lead extend from a first side of the package body, and the at least one secondary lead extends from a second side of the package body opposite to the first side of the package body.
5 more elements
A method of sensing a current in a current sensor integrated circuit package comprising:
- providing a primary conductor having an input lead and an output lead, a first die attach portion, a second die attach portion and a primary conductor portion, wherein the primary conductor is configured to carry a current from the input lead through the first die attach portion, the primary conductor portion, the second die attach portion, and the output lead;
- providing a mechanical locking feature in the primary conductor spaced from a die attach portion edge adjacent to the input lead or the output lead and from the primary conductor portion;
- providing at least one secondary lead;
- providing a semiconductor die disposed adjacent to the primary conductor;
- providing at least one magnetic field sensing element supported by the semiconductor die;
- wherein the at least one magnetic field sensing element is positioned near the primary conductor portion;
- and
- providing an output signal representative of the current in the primary conductor.
5 more elements
Dependencies are inferred from the claim text.