Back to results
US 11,768,225 B2Granted
Removable contactless probe
AssigneeInternational Business Machines Corporation
InventorsMatteo Cocchini, Kyle Olson, Noah Singer
Life of this patent
Estimating the term…
Abstract
A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.
Claims20
A system, said system comprising:
- a printed circuit board with a microstrip, wherein said printed circuit board has a first surface, wherein said first surface is on a first plane, and wherein said microstrip is on said first surface of said printed circuit board;
- a conductive structure surrounding said microstrip, wherein said conductive structure extends along a second plane, and wherein said second plane is substantially perpendicular to said first plane;
- a probe lead in communication with said conductive structure;
- a first contact pad electrically connected to said conductive structure;
- and
- a second contact pad electrically connected to said conductive structure.
3 more elements
A method, said method comprising:
- surrounding a microstrip with a conductive structure to form a first portion, wherein said conductive structure extends along a structure plane;
- embedding said first portion in a printed circuit board, wherein said printed circuit board has a surface, wherein said surface is on a surface plane, wherein said microstrip is on said surface of said printed circuit board, and wherein said surface plane is substantially perpendicular to said structure plane;
- connecting, electrically, a first contact pad and a second contact pad to said conductive structure;
- and
- extending a second portion above said surface of said printed circuit board.
2 more elements
A method, said method comprising:
- providing a near field structure proximate a surface of a printed circuit board, wherein said surface is on a first plane, wherein said near field structure comprises:
- a conductive structure surrounding a microstrip on said printed circuit board, wherein said microstrip is on said surface of said printed circuit board, wherein said conductive structure extends along a second plane, and wherein said second plane is substantially perpendicular to said first plane;
- a first contact pad electrically connected to said conductive structure, wherein said first contact pad extends above a surface of said printed circuit board;
- and
- a second contact pad electrically connected to said conductive structure, wherein said second contact pad extends above said surface of said printed circuit board;
- and
- connecting, electrically, a probe lead to said near field structure.
4 more elements
Dependencies are inferred from the claim text.