Micromechanical sensor

A micromechanical sensor, comprising:

• a micromechanical chip having a first micromechanical structure;
• a first evaluation chip having a first application-specific integrated circuit;
• a second evaluation chip having a second application-specific integrated circuit, the first evaluation chip and the micromechanical chip being situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip, the first evaluation chip being directly electrically conductively connected with the second evaluation chip, the first application-specific integrated circuit primarily including analog circuit elements, and the second application-specific circuit primarily including digital circuit elements,
• a further micromechanical chip having a second micromechanical structure;
• wherein the second evaluation chip and the further micromechanical chip are situated in a stacked manner, the further micromechanical chip being directly electrically conductively connected with the first evaluation chip;
• wherein a first bond pad series of the micromechanical chip is connected with the first evaluation chip using bond wires, a second bond pad series of the further micromechanical chip is connected with the first evaluation chip using bond wires, the first bond pad series and the second bond pad series being situated perpendicularly with regard to one another.