Thermal barrier between high-temperature sensor and electronics in a capacitance diaphragm gauge

A pressure sensing system comprising:

• a capacitance diaphragm gauge (CDG) operating at a first temperature, wherein the CDG is capable of coupling to a source of a pressure to be measured;
• an electronics enclosure operating at a second temperature, the first temperature greater than the second temperature, the electronics enclosure enclosing electronics that are electrically coupled to the CDG;
• and
• a thermal barrier enclosure housing the CDG and interconnecting the CDG to the electronics enclosure, the thermal barrier enclosure comprising:
• a side wall surrounding the CDG;
• a first wall configured to mechanically engage the CDG;
• a second wall configured to engage the electronics enclosure, the second wall spaced apart from the first wall;
• a central interconnection strut connected to the first wall and the second wall, wherein the central interconnection strut defines a central through bore in which a coaxial conductor extending from the CDG is disposed, and wherein signals are transmitted between the CDG and the electronics enclosed by the electronics enclosure via the coaxial conductor;
• and
• an intermediate thermal restriction and ventilation portion interconnecting the first wall and the second wall, the intermediate thermal restriction and ventilation portion comprising a plurality of struts that surround the central interconnection strut.

A thermal barrier to interconnect a capacitance diaphragm gauge (CDG) operating at a first temperature with an electronics enclosure operating at a second temperature, the first temperature greater than the second temperature, the thermal barrier comprising:

• a first mounting interface configured to mechanically engage the CDG;
• a second mounting interface configured to engage the electronics enclosure, the second mounting interface spaced apart from the first mounting interface;
• a central interconnection strut connected to the first mounting interface and the second mounting interface, wherein the central interconnection strut defines a central through bore in which a coaxial conductor extending from the CDG is disposed, and wherein signals are transmitted between the CDG and electronics inside the electronics enclosure via the coaxial conductor;
• and
• an intermediate thermal restriction and ventilation portion interconnecting the first mounting interface and the second mounting interface, the intermediate thermal restriction and ventilation portion comprising a plurality of struts that surround the central interconnection strut.