Flow sensing device
AssigneeHoneywell International Inc.
InventorsScott Edward Beck, Yong-Fa Wang, Philip C. Foster
Life of this patent
Estimating the term…
Abstract
Methods and apparatuses associated with an example flow sensing device are provided. In some examples, the flow sensing device may include a flow cap component and a sensor component. In some examples, the flow cap component may include a heating element disposed in a first layer of the flow cap component. In some examples, the sensor component may include at least one thermal sensing element disposed in a second layer of the sensor component. In some examples, the first layer and the second layer are noncoplanar. In some examples, the flow cap component may be bonded to a first surface of the sensor component to form a flow channel. In some examples, the first layer and the second layer may be noncoplanar and separated by the flow channel.
Claims18
A flow sensing device, comprising:
- a flow cap component comprising a heating element disposed in a first layer of the flow cap component;
- a sensor component comprising at least one thermal sensing element disposed in a first layer of the sensor component, wherein the flow cap component is bonded to the sensor component via an attachment component, wherein the sensor component comprises at least one plate element disposed on a second layer of the sensor component, wherein the at least one plate element at least partially overlaps with the at least one thermal sensing element;
- and
- wherein a first portion of a first surface of the flow cap component is bonded to a first surface of the attachment component, wherein a first portion of a first surface of the sensor component is bonded to a second surface of the attachment component, wherein the flow cap component, the sensor component, and the attachment component form a flow channel.
A method for manufacturing a flow sensing device, the method comprising:
- providing a flow cap component comprising a heating element disposed in a first layer of the flow cap component;
- providing a sensor component comprising at least one thermal sensing element disposed in a first layer of the sensor component and at least one plate element disposed on a second layer of the sensor component, wherein the at least one plate element at least partially overlaps with the at least one thermal sensing element;
- and
- bonding the flow cap component to the sensor component via an attachment component, wherein a first portion of a first surface of the flow cap component is bonded to a first surface of the attachment component, wherein a first portion of a first surface of the sensor component is bonded to a second surface of the attachment component, wherein the flow cap component, the sensor component, and the attachment component form a flow channel.
Dependencies are inferred from the claim text.