Thermally conductive moisture-curable resin composition and cured product thereof

A thermally conductive moisture-curable resin composition comprising the following components (A) to (C):

• component (A):
• an organic polymer containing two or more hydrolyzable silyl groups;
• component (B):
• a first thermally conductive filler (B1) and a second thermally conductive filler (B2);
• and
• component (C):
• a silicone compound having a polar group and/or a polar chain at a terminal or a side chain,
• wherein an amount of the component (C) added is 1 to 50 parts by mass based on 100 parts by mass of the component (A),
• the first and second thermally conductive fillers (B1) and (B2) are selected from the group consisting of alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, carbon, and diamond,
• the first thermally conductive filler (B1) has an average particle diameter of 0.01 μm or more and less than 2.0 μm,
• the second thermally conductive filler (B2) has an average particle diameter of 2.0 μm or more and less than 150 μm,
• an amount of the second thermally conductive filler (B2) is 10 to 300 parts by mass, based on 100 parts by mass of the first thermally conductive filler (B1), and
• the composition does not include silica.