Adhesive, die attach film and preparation method therefor

Abstract

Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.

Dependencies are inferred from the claim text.