Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture

A copper particle mixture consisting essentially of copper fine particle A and copper nanoparticle B,

• the copper fine particle A having an average particle diameter of not less than 0.1 μm and not more than 5 μm, and being coated with malonic acid,
• the copper nanoparticle B comprising a central portion comprising a copper single crystal, and a protective layer surrounding the central portion, and having an average particle diameter of not less than 1 nm and less than 100 nm, and
• the protective layer of the copper nanoparticle B containing at least one member selected from the group consisting of C3-6 primary alcohols, C3-6 secondary alcohols, and derivatives thereof.

A copper particle mixture consisting essentially of copper fine particle A and copper nanoparticle B,

• the copper fine particle A having an average particle diameter of not less than 0.1 μm and not more than 0.96 μm, and being coated with at least one of oxalic acid and malonic acid,
• the copper nanoparticle B comprising a central portion comprising a copper single crystal, and a protective layer surrounding the central portion, and having an average particle diameter of not less than 1 nm and less than 100 nm, and
• the protective layer of the copper nanoparticle B containing at least one member selected from the group consisting of C3-6 primary alcohols, C3-6 secondary alcohols, and derivatives thereof.