Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsShunsuke Katagiri, Takuya Suzuki, Seiji Shika, Yune Kumazawa
Life of this patent
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Abstract
A compound (A) of the present invention is represented by the formula (1): wherein each R1 independently represents a group represented by the formula (2) or a hydrogen atom, and each R2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the formula (2); and wherein -* represents a bonding hand.
Claims13
A compound represented by the following formula (17):
A resin composition comprising a compound represented by the following formula (16) and/or a compound represented by the following formula (17):
- and
- a bismaleimide compound (B) comprising a constituent unit represented by the following formula (7) and maleimide groups at both ends of the molecular chain:
- wherein R4 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms;
- R5 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms;
- each R6 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms;
- and each n1 independently represents an integer of 1 to 10.
Dependencies are inferred from the claim text.