MEMS devices and methods of forming thereof
AssigneeVanguard International Semiconductor Singapore Pte. Ltd.
InventorsRanganathan Nagarajan, Jia Jie Xia, Rakesh Kumar, Bevita Kallupalathinkal Chandran
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Abstract
A method of forming a MEMS device includes providing a substrate having a device stopper. The device stopper is integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may be formed in the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be formed over the thermal dielectric isolation layer and the device cavity.
Claims9
A method of forming a MEMS device, comprising:
- providing a substrate comprising a device stopper, wherein the device stopper is integral to the substrate and formed of the substrate material;
- and
- arranging a dielectric isolation layer over the device stopper and the substrate, wherein the dielectric isolation layer is formed by thermal oxidation, and a top surface of the substrate and a top surface of the device stopper both are in contact with the dielectric isolation layer and on the same plane;
- forming a device cavity in the substrate and the dielectric isolation layer;
- wherein the dielectric isolation layer and the device stopper are adjacent to the device cavity;
- and
- forming an active device layer over the dielectric isolation layer and the device cavity.
Dependencies are inferred from the claim text.