Molding packaging material, power storage device packaging case, and power storage device
AssigneeShowa Denko Packaging Co., Ltd.
InventorsKenji Yoshino, Makoto Karatsu, Takashi Nagaoka
Life of this patent
Estimating the term…
Loading patent…
AssigneeShowa Denko Packaging Co., Ltd.
InventorsKenji Yoshino, Makoto Karatsu, Takashi Nagaoka
Estimating the term…
Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer 2 as an outer layer, a heat fusible resin layer 3 as an inner layer, and a metal foil layer 4 arranged between the two layers. The heat fusible resin layer 3 is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer 3 is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.
A molding packaging material comprising:
A molding packaging material comprising:
A molding packaging material comprising:
A molding packaging material comprising:
Dependencies are inferred from the claim text.