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US 11,766,826 B2Granted
Reducing stresses in metal layers
AssigneeHewlett-Packard Development Company, L.P.
InventorsKrzysztof Nauka, Chris Paul Schodin
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Abstract
A system may include a printhead for ejecting a first fluid including a polymer, the ejected first fluid forming a substrate with a thermal conductivity of less than 0.5 W/(m-K); a spreader to spread a layer of metal particulate on the substrate, wherein the printhead further ejects a second fluid, the ejected second fluid masking a portion of the layer of metal particulate on the substrate; and a pulse irradiation light source to fuse an unmasked portion of the layer of metal particulate.
Claims13
A method of forming a metal object, the method comprising:
- forming a polymer substrate on which the metal object is be formed by applying a layer of latex to a plate, the latex having a lower thermal conductivity than the plate;
- forming a pattern in the layer of latex, wherein the pattern is to convey information about the metal object;
- spreading a layer of metal particles over the polymer substrate, wherein a thermal conductivity through the polymer substrate is within a 20% range of a thermal conductivity through the layer of metal particles;
- masking a portion of the layer of metal particles;
- and
- melting an unmasked portion of the layer of metal particles using a pulse light source.
3 more elements
Dependencies are inferred from the claim text.