Multi-path cooling for robotic systems

A robotic system, comprising:

• a heat generating component positioned within a base that supports one or more articulating links;
• a bracket supporting the heat generating component, wherein the heat generating component is mounted on and directly contacts the bracket, wherein the bracket is thermally conductive;
• a first thermally conductive path configured to dissipate heat from the heat generating component, the first thermally conductive path comprising the bracket and a first heatsink connected to the bracket, wherein the first heatsink is positioned on a first side of the base;
• and
• a second thermally conductive path configured to dissipate heat from the heat generating component, the second thermally conductive path comprising the bracket, a thermal pad positioned on the bracket, and a second heatsink positioned on a second side of the base, wherein the thermal pad is in thermal communication with the second heatsink.

A method for dissipating heat in a robotic system, the method comprising:

• mounting a heat generating component on a bracket within a base of a robotic arm, the bracket being thermally conductive;
• attaching the bracket to a first heatsink positioned on a first side of the base to form a first thermally conductive path configured to dissipate heat from the heat generating component;
• and
• contacting a thermal pad positioned on the bracket to a second side of the base to form a second thermally conductive path configured to dissipate heat from the heat generating component to a second heatsink positioned on the second side of the base.