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US 11,766,765 B2Granted
Substrate treatment apparatus
AssigneeSemes Co., Ltd.
InventorsKi Sang Eum, Byoung Ok Kim, Jae Hun Jeong, Ju Eun Kim, Jun Ho Seo, Man Kyu Kang
Life of this patent
Estimating the term…
Abstract
A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.
Claims13
A substrate treatment apparatus comprising:
- a substrate support part provided with a seating surface and configured to support a substrate;
- a guide ring annularly disposed along an edge of the substrate support part to surround the substrate;
- and
- a centering part including a body provided inside the guide ring, the body configured to center the substrate by moving into and out of the guide ring into a space above the seating surface in a linear direction parallel to the seating surface toward a central axis of the guide ring to pressurize an edge of the substrate, the centering part further comprising at least one elastic body configured to elastically move the body with respect to the substrate support part,
- wherein the centering part further includes:
- a head provided at one side end of the body and configured to move together with the body to pressurize the edge of the substrate;
- and
- the at least one elastic body comprises a plurality of elastic bodies each having one side fixed to the substrate support part and the other side connected to the body to provide an elastic force in a linear direction parallel to the seating surface away from the central axis of the guide ring to elastically move the body with respect to the substrate support part.
5 more elements
Dependencies are inferred from the claim text.