Automatic soldering processing system and automatic soldering processing method

An automatic soldering processing method, incorporated with an automatic soldering processing system to process an electronic product with at least one soldering point, comprising:

• a) obtaining a soldering-point image of the soldering point, wherein the electronic product is a PCB, the soldering point comprises a soldering pad and a pin-through hole for being inserted by a component pin, the soldering-point image comprises images of the soldering pad, the pin-through hole, and the component pin;
• b) generating soldering-parameter sets in accordance with at least one of a first size, a first shape, and a first direction of the soldering pad, a second size, a second shape, and a second direction of the pin-through hole, and a third size, a third shape, and a third direction of the component pin of the soldering-point image, wherein each of the soldering-parameter sets comprises a solder feeding speed, a solder feeding amount, a moving speed, a moving path, a heating temperature, and a heating time,
• b11) creating a virtual 3D model in accordance with the soldering-point image;
• b12) applying the soldering-parameter sets to the virtual 3D model to perform a simulation soldering procedure and generate a simulated result;
• b13) before a soldering quality indicated by the simulated result meets a preset quality threshold and an execution number of the simulation soldering procedure reaches a simulated number, updating the soldering-parameter sets according to the simulated result and re-executing the step b12);
• b14) when the soldering quality meets the preset quality threshold or the execution number of the simulation soldering procedure reaches the simulated number, generating an optimized soldering-parameter sets in accordance with the simulated result;
• c) controlling a solder feeding unit of the automatic soldering processing system to feed a solder in accordance with the solder feeding speed and the solder feeding amount of the optimized soldering-parameter sets;
• d) bringing an iron tip of the automatic soldering processing system to move in accordance with the moving speed and the moving path of the optimized soldering-parameter sets;
• and
• e) controlling the iron tip to perform heating and execute a soldering action to the soldering point through the solder in accordance with the heating temperature and the heating time of the optimized soldering-parameter sets.