Implantable medical device with locking datum arrangement between DF4/IS4 assembly and header
AssigneePacesetter, Inc.
InventorsEvan Sheldon, Armando M. Cappa, Christopher J. Fleck, Arees Garabed
Life of this patent
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Abstract
Disclosed herein is an implantable electronic device. The device includes a housing and a header connector assembly coupled to the housing. The header connector assembly includes a DF4/IS4 assembly and a header including a bore. The DF4/IS4 assembly is locked within the bore via a locking datum arrangement that exists between the DF4/IS4 assembly and the header.
Claims20
A method of manufacturing an implantable electronic device, the method comprising:
- inserting a DF4/IS4 assembly into a bore of a header, the DF4/IS4 assembly defining a receptacle configured to receive a lead connector end of an implantable lead;
- and
- rotating the DF4/IS4 assembly within the bore to engage a locking datum arrangement that exists between the DF4/IS4 assembly and the header, the locking datum arrangement preventing the DF4/IS4 assembly from being withdrawn from the bore.
A method of manufacturing an implantable electronic device, the method comprising:
- inserting a DF4/IS4 assembly into a bore of a header, the DF4/IS4 assembly defining a receptacle configured to receive a lead connector end of an implantable lead;
- and
- rotating the DF4/IS4 assembly within the bore to engage a locking datum arrangement that exists between the DF4/IS4 assembly and the header, the locking datum arrangement preventing the DF4/IS4 assembly from being withdrawn from the bore, wherein:
- the DF4/IS4 assembly includes a first portion of the locking datum arrangement,
- the header further defines a second portion of the locking datum arrangement disposed along the bore and forming an interface with the first portion of the locking datum arrangement, and
- the DF4/IS4 assembly is locked within the bore via the interface between the first portion of the locking datum arrangement and the second portion of the locking datum arrangement.
A method of manufacturing an implantable electronic device, the method comprising:
- inserting a connector assembly into a bore of a header, the connector assembly defining a receptacle configured to receive a lead connector end of an implantable lead;
- and
- engaging a locking datum arrangement that exists between the connector assembly and the header, the locking datum arrangement preventing the connector assembly from being withdrawn from the bore,
- wherein:
- the connector assembly includes a first portion of the locking datum arrangement,
- the header further defines a second portion of the locking datum arrangement disposed along the bore and forming an interface with the first portion of the locking datum arrangement, and
- the connector assembly is locked within the bore via the interface between the first portion of the locking datum arrangement and the second portion of the locking datum arrangement.
Dependencies are inferred from the claim text.