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US 11,765,824 B2Granted
Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsNorimichi Noguchi, Masateru Mikami, Kenji Toyoshima, Hiroki Oda, Daisuke Suetsugu, Tatsuya Urakawa
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Abstract
A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
Claims10
A laminated ceramic sintered body board for an electronic device, the laminated ceramic sintered body comprising:
- a ceramic sintered body board;
- and
- a flattening film provided on an upper surface of the ceramic sintered body board, the flattening film containing a thermally conductive filler,
- wherein the thermally conductive filler is one or more kinds of compounds selected from the group consisting of zinc oxide (ZnO), magnesium oxide (MgO), beryllium oxide (BeO), boron nitride (BN), silicon nitride (SiNx), and diamond, and
- a matrix of the flattening film includes silicon dioxide (SiO2) or aluminum oxide (Al2O3).
2 more elements
A chip resistor comprising:
- a laminated ceramic sintered body board for an electronic device, the laminated ceramic sintered body comprising:
- a ceramic sintered body board;
- a flattening film provided on an upper surface of the ceramic sintered body board, the flattening film containing a thermally conductive filler,
- wherein the thermally conductive filler is one or more kinds of compounds selected from the group consisting of zinc oxide (ZnO), magnesium oxide (MgO), beryllium oxide (BeO), aluminum nitride (AlN), boron nitride (BN), silicon nitride (SiNx), and diamond, and a matrix of the flattening film includes silicon dioxide (SiO2) or aluminum oxide (Al2O3);
- a resistance element and a pair of upper electrodes, the resistance element and the pair of upper electrodes each being provided on a first surface of the flattening film of the laminated ceramic sintered body board, the first surface being opposite to a second surface of the flattering film, the second surface being on the ceramic sintered body board;
- and
- a pair of end surface electrodes arranged in a lamination direction of the laminated ceramic sintered body board and the upper electrodes and being in contact with ends of the laminated ceramic sintered body board and the upper electrodes.
4 more elements
Dependencies are inferred from the claim text.